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Singh, Kamaljeet
- Characterization and Mitigation of Electro-Static Bonding Failures in Microsensors
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Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, IN
1 Systems Engineering Group, ISRO Satellite Centre, IN
Source
ICTACT Journal on Microelectronics, Vol 3, No 1 (2017), Pagination: 345-348Abstract
Electrostatic bonding between glass and silicon is carried out in micro sensor devices to achieve higher bond strength thus eliminating the requirement of adhesives. This can also be useful in providing hermiticity and results in reliable operation of the micro sensor devices. Practically the sensor performance is prone to long term drift mainly due to process associated with the assembly and packaging. Bonding is the one of the critical process in micro sensor and generally sensor stability is dependent on this process along with other packaging material and methodology. Bond strength is one of the critical parameters to find out the quality of bond and the same is quantified and compared for different conditions. This article details electrostatic bonding process, various parameters responsible for the reliable bonding, modelling and characterization along with simple methodology to achieve higher bond strength.Keywords
Bonding, Micro-Sensor, Anodic, Electrostatic, Sensor, Bond Strength.
References
- Kamaljeet Singh and A.V. Nirmal, “Reliability Aspects in RF-MEMS Circuits for Space Applications”, Journal of Engineering and Technology Research, Vol. 4, No. 6, pp. 1-11, 2016.
- W.H. Ko, J.T. Suminto and G.J. Yeh, “Bonding Techniques for Microsensors”, Proceedings of Conference on Micromachining and Micropackaging of Transducers, pp. 41-61, 1985
- Mohamed Gad-el-Hak, “The MEMS Handbook”, 2nd Edition, CRC Press, 2002.
- K. Petersen, P. Barth, J. Poydock, J. Brown, J. Mallon and J. Bryzek, “Silicon Fusion Bonding for Pressure Sensors”, Proceedings of IEEE Solid State Sensor and Actuator Workshop, pp. 144-147, 1998.
- Hyun S. Kim, Robert H. Blick, D.M. Kim and C.B. Eom, “Bonding Silicon-on-Insulator to Glass Wafers for Integrated Bio-Electronic”, Applied Physics Letters, Vol. 85, No. 12, pp. 2370-2373, 2004.
- R. Knechtel, G. Dahlmann and U. Schwarz, “Low and High Temperature Silicon Wafer Direct Bonding for Micromechanical Absolute Pressure Sensor”, Proceedings Electromechanical Society, pp. 205-207, 2005.
- G. K. Ananthasuresh, K.J. Vinoy, S. Gopalakrishnan, K.N. Bhat and V.K. Aatre, “Micro and Smart Systems”, Wiley, 2010.
- Contaminations in MEMS Processes and Removal Methodology
Abstract Views :200 |
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Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, IN
1 Systems Engineering Group, ISRO Satellite Centre, IN
Source
ICTACT Journal on Microelectronics, Vol 3, No 1 (2017), Pagination: 375-378Abstract
Wafer impurities and process particulates are one of the prime reason of MEMS device failure. Various cleaning methodologies are evolved but cleaning remains a critical process in MEMS domain as varied materials along with micromachining operations are involved. Bulk and surface micromachining process results in etching of substrate as well as various layers which necessitate evolving of proper cleaning methodology to avoid device failure. This article details the sources of contamination, role of contamination in MEMS domain, cleaning and measurement techniques to mitigate the effect on the device performance.Keywords
MEMS, Contamination, Residues, Particulates, Defects.References
- Rajiv Kohli and K.L. Mittal, “Developments in Surface Contamination and Cleaning”, 1st Edition, Elsevier, 2014.
- Gary K Feeder, “MEMS Fabrication”, Proceedings of IEEE-ITC International Test Conference, pp. 691-698, 2003.
- Mohamed Gad-el-Hak, “The MEMS Handbook”, 2nd Edition, CRC Press, 2002.
- G.K. Ananthasuresh, K.J. Vinoy, S. Gopalakrishnan, K.N. Bhat and V.K. Aatre, “Micro and Smart Systems”, Wiley, 2010.
- Janusz Bryzek, “Principles of MEMS: Handbook of Measuring System Design”, John Wiley and Sons, 2011.
- Werner Kern, “The Evolution of Silicon Wafer Cleaning Technology”, Journal of Electrochemical Society, Vol. 37, No. 6, pp. 1887-1892, 1990.
- Chandan Kumar Sarkar and Sunipa Roy, “MEMS and Nanotechnology for Gas Sensors”, CRC Press, 2015.
- Kamaljeet Singh and A.V. Nirmal, “Reliability Aspects in RF-MEMS Circuits for Space Applications”, Journal of Engineering and Technology Research, Vol. 4, No. 6, pp. 1-11, 2016.
- J. Grym, “Semiconductor Technologies”, InTech Publisher, 2010.
- Overview of MEMS Sensors and Associated Aspects
Abstract Views :210 |
PDF Views:6
Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
Source
ICTACT Journal on Microelectronics, Vol 3, No 2 (2017), Pagination: 411-416Abstract
MEMS technology is pervading in all domains ranging from commercial to strategic sectors so it is imperative that application oriented development encompassing fabrication, characterization, assembly and packaging aspects to be looked into to get the reliable product. This article details the overview of MEMS sensors and various aspects such as thin film process, process characterization tools, assembly along with challenges in realization are presented. Reduction in measurement inaccuracy is extremely important and main parameters associated with the sensors are explained.Keywords
MEMS, Sensors, Fabrication Process, Assembly.References
- G.K. Ananthasuresh, K.J. Vinoy, S. Gopalakrishnan, K.N.Bhat and V.K. Aatre,“Micro and Smart Systems”, Wiley India, 2010.
- Sunipa Roy and Chandan Kumar Sarkar, “MEMS and Nanotechnology for Gas Sensors”, 1st Edition, CRC Press 2016.
- Kamaljeet Singh, “Substrate Material Considerations in MEMS Processes for RF Applications”, Nano and Microsystems Technology, Vol. 19, No. 7, pp. 428-431, 2017.
- Kamaljeet Singh and A.V. Nirmal, “Reliability Aspects in RF-MEMS Circuits for Space Applications”, Journal of Engineering and Technology Research, Vol. 4, No. 6, pp. 1-11, 2016.
- Amit Saxena, Satya N Behera, Kamaljeet Singh and Paritosh Jain, “Process Optimization and Role of Process Parameters for Repeatable Metal Etching”, Proceedings of National Conference on Micro and Nano Fabrication, pp. 1-4, 2013.
- R Osiander, M.A.G. Darren and J.L. Champion, “MEMS and Microstructures in Aerospace Applications” , 1st Edition, CRC Press, 2005.
- Janusz Bryzek,“Principles of MEMS: Handbook of Measuring System Design”, John Wiley and Sons, 2011.
- Kamaljeet Singh, A.V. Nirmal and S.V. Sharma, “Investigation of Drift Phenomena Observed in Platinum Thin Film based Temperature Sensor for Metrological Applications”, Proceedings of 2nd National Conference on Recent Developments in Electronics, pp. 12-16, 2017.
- Kamaljeet Singh and A.V. Nirmal, “Development and Characterization of RF-MEMS Shunt Switch at Ka-Band”, Proceedings of 8th International Conference on Smart Materials, Structures and Systems, pp. 31-32, 2017.
- N. Yazdi, F Ayazi and K Najafi, “Micromachined Inertial Sensors”, Proceedings of IEEE, Vol. 86, No. 8, pp. 1640-1657, 1998.
- Jan Grym, “Semiconductor Technologies”, InTech Publisher, 2010.
- Mohamed Gad-El-Hak, “The MEMS Handbook” , 1st Edition, CRC Press, 2002.
- P. Malshe, W.D. Brown, W.P. Eaton and W.M. Miller, “Challenges in the Packaging of MEMS” , International Journal of Microcircuits and Electronic Packaging, Vol. 22, No. 3, pp. 233-241, 1999.
- Semi-Conductor Ambience For Building Self-Reliance in the Country
Abstract Views :169 |
PDF Views:0
Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
Source
ICTACT Journal on Microelectronics, Vol 3, No 4 (2018), Pagination: 488-493Abstract
In the present era of importing chips are the major bottlenecks in attaining self-reliance for the strategic sector in the country. The existing trend of chip development at nanometer geometry needs huge and constant capital investment which is not possible in present scenario. The requirement of the country is to have maximum and efficiently utilization of available technology which can cater for achieving self-reliance in strategic sector requirements. Further effort towards miniaturization and multiple operations using single chip solution can put country on the world map. The major bottlenecks in the country are the fabrication and realization of such systems which can leads to self-reliance in the country. In spite of the whole hearted support of the government still we are far behind in achieving self-sufficiency with the available technology node. Some of the industries closed their manufacturing operations and remaining are not performing as per expectations. In spite of leaders in chip design and flooded with best talent still we are way behind self-reliance in the area of semiconductor in spite of huge investments. This article will bring out the foundry complexity, present scenario in the country, corrective methodology, and suggestive framework for creating semiconductor ambience in the country.Keywords
Semiconductor Industry, Self-Reliance, Technology Upgradation, Integrated Circuits.References
- Pratik A Joshi, “Indian Electronics Industry-A Persuasive Growth Engine behind the Soaring Economy of India”, International Journal of Education Economics and Development, Vol. 1, pp. 1-5, 2015.
- S. Das, “The Indian Electronics Industry in 2017-18: Key Opportunity and Trends”, Available at: http://www.electronicsb2b.com/eb-specials/industry-report/indian-electronics-industry-2017-18-key-opportunities-trends/
- H. Kushwah and A. Seth, “Future of Semiconductor Fabrication Industries in India-Opportunities and Challenges”, International Journal of Research in Engineering and Technology, Vol. 4, No. 8, pp. 72-75, 2015.
- Dipayan D Chaudhuri, “Technology Transfer and In-House R and D in Indian Electronics Industry under Economic Liberalization”, Allied Publishers, 1999.
- ITRS Report, Available at: http://www.itrs2.net/itrs-reports.html, Accessed on 2015.
- Kamaljeet Singh, “Major Steps in Thin Film Process and Overview of Various Resources”, Antriksh Gyan Sarita-Annual Magazine, Vol. 1, pp. 84-89, 2015.
- Kamaljeet Singh and A.V. Nirmal, “Technological Advancement by Bridging the gap between Industry and Academia”, Proceedings of 5th International Conference on MOOCs,Innovation and Technology in Education, pp. 11-15, 2017.
- Kamaljeet Singh and A.V. Nirmal, “Reliability Aspects in RF-MEMS Circuits for Space Applications”, Journal of Engineering and Technology, Vol. 4, No. 6, pp. 1-11, 2016.
- Kamaljeet Singh and A.V. Nirmal, “Growth Model of ISRO Growth in Indian Perspective”, Proceedings of 5th International Conference on Emerging Trends in Engineering, Technology, Science and Management, pp. 563-568, 2017.
- W. Schaufeli and A. Bakker, “Work Engagement Scale”, Preliminary Manual, Utrecht University, 2004.
- B.K. Bahinipati, “A Frame Work for Semiconductor Industry Supply Chain Planning”, International Journal of Intelligent Enterprise, Vol. 1, No. 3-4, pp. 290-314, 2012.
- Process and Modelling Aspects of Polyimide Over Silicon for RF Circuits Realization and its Implementation
Abstract Views :143 |
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Authors
Affiliations
1 U R Rao Satellite Centre, Indian Space Research Organisation, IN
1 U R Rao Satellite Centre, Indian Space Research Organisation, IN
Source
ICTACT Journal on Microelectronics, Vol 5, No 1 (2019), Pagination: 711-714Abstract
The integration of RF circuits with CMOS on the same substrate is challenging and imposes lot of constraint in practical realization due to inherent losses associated with silicon Si substrate. Various mitigation techniques are proposed to overcome the same which are either process intensive or introduces multiple deleterious effects at RF frequencies. Polyimide is used both in microelectronics and MEMS industry as it can act both as a photo-resist and also having key dielectric properties. The processes presented with polyimide are standard and can be easily integratable with the existing CMOS processes. Fabrication steps and simulation study of the band pass filter topologies over polyimide are presented and the same are fabricated with the proposed process steps. Further this article details the modelling, theoretical aspects, various process steps and actual implementation with the realization of the band pass filter topology using the proposed methodology.Keywords
Polyimide, Silicon, Radio Frequency, Modelling.- RF Circuit Realisation Using Thick Film Technology
Abstract Views :143 |
PDF Views:0
Authors
Affiliations
1 Systems Engineering Group, U R Rao Satellite Centre, IN
2 HMC and Indigenization Group, U R Rao Satellite Centre, IN
1 Systems Engineering Group, U R Rao Satellite Centre, IN
2 HMC and Indigenization Group, U R Rao Satellite Centre, IN
Source
ICTACT Journal on Microelectronics, Vol 7, No 2 (2021), Pagination: 1115-1120Abstract
Thick film technology is mostly employed at lower frequency circuits such as hybrid micro circuits due to the associated losses of the paste. The characterisation and implementation of the conductive paste at higher frequencies is important so as to employ this technique at higher frequencies. Also the role of ceramic substrate due to higher dielectric losses needs detailed measurement to deduce the useful range of this technique with the selected paste. In this article simple transmission line using the thick film technology is fabricated, characterised and result of the thick and thin film technologies are compared. Subsequently RF circuits such as filter are fabricated using both thick and thin film fabrication technology and comparative analysis carried out. The line losses of 0.01 dB/cm up till 5 GHz is achieved using the standard gold paste. This article details the fabrication process, implementation methodology, design aspects, simulation and comparative analysis of the microstrip circuits such as transmission line and band pass filter.Keywords
Thick Film, Microstrip, Band Pass Filter, Transmission Line.References
- J.S. Hong and M.J. Lancaster, “Microstrip Filters for RF/Microwave Applications”, Wiley, 2001.
- Kenganahalli G. Avinash and Inabathini Srinivasa Rao “Compact Dual-Mode Microstrip Bandpass Filters with Transmission Zeros using Modified Star Shaped Resonator”, Progress In Electromagnetics Research C, Vol. 71, pp. 177-187, 2017.
- R. Wayne Johnson, Phil W. Rich, Debbie D. Rich and Larry K. Wilson, “Advances in Thick Film Conductors for Microwave Integrated Circuits”, Electro-Component Science and Technology, Vol. 6, pp. 215-218, 1980.
- David M. Pozar, “Microwave Engineering”, John Wiley and Sons, 2010.
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- Rashmi Behera and Venkatesh Darukesha, “Development of MMIC based C-Band LNA”, Proceedings of National Conference on Systems for Transforming India: Challenges and Opportunities, pp. 1-7, 2019.
- Ajay Andhiwal, Usha Murthy and N.K. Pushpa, “High Density Thick Film Interconnects for Space Application”, Proceedings of International Symposium on Microelectronics, pp. 14-18, 2004.
- K.C. Gupta and C. Garg, “CAD for Microstrip Circuits”, Artech House, 2015.
- R A Zakarevicius, “Microwave Engineering using Microstrip Circuits”, Prentice Hall, 2016.
- L G Maloratsky, “Reviewing the Basics of Microstrip Line”, Microwaves and RF, Vol. 39, No. 3, pp. 79-88, 2000.
- Ayan Karamakar and K Singh, “Si-RF Technology”, Springer, 2019.
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- Thomas H. Lee, “Planner Microwave Engineering-A Practical Guide to Theory, Measurement and Circuits”, Cambridge University Press, 2004.
- Harsh Dashora, Jitendra Kumar and D. Mamatha, “Test Platform for RF Systems and Implementation using Planer Technique”, Proceedings of International Conference on Physical Sciences, pp. 1-17, 2020.
- H.A. Wheeler, “Transmission Line Properties of Parallel Strips Separated by a Dielectric Sheet”, IEEE Transactions on Microwave Theory and Techniques, Vol. 13, No. 2, pp. 172-185, 1965.
- K.V. Vamsi, A.V.G. Subramanyam and V.V. Srinivasan, “Miniaturized Micrsotrip High-Selectivity Bandpass Filters with Asymmetric Frequency Characteristics”, Proceedings of International Conference on Microwave, pp. 341-347, 2014.
- C. Hua, C. Chen, C. Miao, and W. Wu, “Microstrip Bandpass Filters using Dual Mode Resonators with Internal Coupled Lines”, Progress in Electromagnetics Research C, Vol. 21, pp. 99-111, 2011.
- I. Wolff and L. Knoppikn, “Microstrip Ring Resonator and Dispersion Measurement on Microstrip Lines”, Electronics Letters, Vol. 3, No. 2, pp. 779-781, 1971.
- Mitsuo Makimoto and Sadahiko Yamashita, “Bandpass Filter using Coupled Stripline Steeped Impedance Resonators”, IEEE Transactions on Microwave Theory and Techniques, Vol. 28, No. 12, pp. 1-13, 1980.
- Yaqeen S. Mezaal and Jawad K. Ali, “Investigation of Dual-Mode Microstrip Bandpass Filter Based on SIR Technique”, PLoS ONE, Vol. 11, No. 10, pp. 1-13, 2019.